Title:
PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2017/125966
Kind Code:
A1
Abstract:
According to the present invention, a photosensitive resin composition contains a carboxyl group-containing resin (A), an unsaturated compound (B) having at least one ethylenic unsaturated bond in a molecule thereof, a photopolymerization initiator (C), an epoxy compound (D), an organic filler (E) including an organic filler (E1) having a carboxyl group and at least one melamine composition (F) selected from the group consisting of melamine and melamine derivatives. A dry film is a dried article of the photosensitive resin composition. A printed wiring board is provided with an interlayer insulation layer or a solder resist layer including a cured article of the photosensitive resin composition.
Inventors:
HIGUCHI MICHIYA (JP)
HASHIMOTO SOICHI (JP)
ARAI TAKASHI (JP)
KAWASATO HIRONOBU (JP)
INABA SHINJI (JP)
HASHIMOTO SOICHI (JP)
ARAI TAKASHI (JP)
KAWASATO HIRONOBU (JP)
INABA SHINJI (JP)
Application Number:
PCT/JP2016/002474
Publication Date:
July 27, 2017
Filing Date:
May 20, 2016
Export Citation:
Assignee:
GOO CHEMICAL CO LTD (JP)
NIPPON STEEL & SUMIKIN CHEM CO (JP)
NIPPON STEEL & SUMIKIN CHEM CO (JP)
International Classes:
G03F7/004; G03F7/027; G03F7/029; G03F7/031
Foreign References:
| JP2002303974A | 2002-10-18 | |||
| JP2006096962A | 2006-04-13 | |||
| JP2011059656A | 2011-03-24 | |||
| JP2005043580A | 2005-02-17 | |||
| JP2011123219A | 2011-06-23 | |||
| JP2012041452A | 2012-03-01 |
Attorney, Agent or Firm:
NISHIKAWA, Yoshikiyo et al. (JP)
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