Title:
PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, PRINTED CIRCUIT BOARD, AND PHOTOBASE GENERATOR
Document Type and Number:
WIPO Patent Application WO/2017/141734
Kind Code:
A1
Abstract:
Provided are a photosensitive resin composition having excellent sensitivity, a dry film having a resin layer obtained from the composition, a cured product of the composition or the dry film resin layer, a printed circuit board having the cured product, and a photobase generator having excellent sensitivity. The photosensitive resin composition and the like are characterized in comprising an ion-type photobase generator that contains a carboxylic acid and a base and is represented by general formula (1). (In formula (1), R1 through R4 and X1 and X2 are each independently a hydrogen atom or substitution group, at least one of X1 and X2 is an electron-attracting group, Y is an electron-releasing group, and B is a base.)
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Inventors:
GUO YANGMEI (JP)
MIWA TAKAO (JP)
ARIMITSU KOJI (JP)
OKAYASU KATSUKI (JP)
MIWA TAKAO (JP)
ARIMITSU KOJI (JP)
OKAYASU KATSUKI (JP)
Application Number:
PCT/JP2017/004015
Publication Date:
August 24, 2017
Filing Date:
February 03, 2017
Export Citation:
Assignee:
TAIYO HOLDINGS CO LTD (JP)
International Classes:
G03F7/004; C07C205/56; C07D233/58; C07D487/04; C09K3/00; G03F7/038; H05K3/28
Domestic Patent References:
| WO2008115572A1 | 2008-09-25 |
Foreign References:
| US3499008A | 1970-03-03 | |||
| JP2011080032A | 2011-04-21 | |||
| JP2009244745A | 2009-10-22 | |||
| JP2007101685A | 2007-04-19 |
Attorney, Agent or Firm:
HONDA Ichiro (JP)
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