Title:
PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, AND PRINTED-WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2019/230616
Kind Code:
A1
Abstract:
Provided is a photosensitive resin composition from which a cured product is obtained when subjected to curing and in which it is possible to suppress corrosion of a cured layer when the surface of the cured product is treated with an oxidizing agent, to minimize excessive surface roughness, and to prevent the surface from becoming uneven. This photosensitive resin composition comprises: a carboxyl-containing resin (A); an unsaturated compound (B) containing at least one ethylenically unsaturated bond per molecule; a photopolymerization initiator (C); an epoxy compound (D); an organic filler (E); silica (F); and a triazine resin (G). The silica (F) has an average primary particle diameter of 1-150 nm.
Inventors:
HIGUCHI MICHIYA
SUZUKI FUMITO
FUJIWARA YUSUKE
TANAKA SHINYA
HASHIMOTO SOICHI
ARAI TAKASHI
SUZUKI FUMITO
FUJIWARA YUSUKE
TANAKA SHINYA
HASHIMOTO SOICHI
ARAI TAKASHI
Application Number:
PCT/JP2019/020791
Publication Date:
December 05, 2019
Filing Date:
May 27, 2019
Export Citation:
Assignee:
GOO CHEMICAL CO LTD (JP)
International Classes:
G03F7/004; G03F7/027; G03F7/075; H05K1/03; H05K3/28
Foreign References:
| JP2017129736A | 2017-07-27 | |||
| JP2017219862A | 2017-12-14 | |||
| JP2014209260A | 2014-11-06 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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