PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, CURED OBJECT, AND ELECTRONIC COMPONENT

Title:

PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, CURED OBJECT, AND ELECTRONIC COMPONENT

Document Type and Number:

WIPO Patent Application WO/2021/065540

Kind Code:

A1

Abstract:

[Problem] To provide a photosensitive resin composition which has a high exposed-area dissolution rate and renders excellent dissolution contrast (resolution) possible. [Solution] A photosensitive resin composition that comprises (A) a polyimide precursor, which is a product of reaction between one or more diamine compounds and one or more dicarboxylic acids, and (B) a photosensitizer, wherein the diamine compounds comprise at least one compound selected from among diamine compounds represented by general formulae (1) and (2) and the dicarboxylic acids comprise at least one compound selected from among carboxylic acid anhydrides and dicarboxylic acid chlorides.

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Inventors:

AKIMOTO MAHO (JP)
KUNITO MEI (JP)
OGATA TOSHIYUKI (JP)

Application Number:

PCT/JP2020/035255

Publication Date:

April 08, 2021

Filing Date:

September 17, 2020

Export Citation:

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Assignee:

TAIYO HOLDINGS CO LTD (JP)

International Classes:

C08G73/10; G03F7/004; G03F7/023; G03F7/075; H05K3/28

Domestic Patent References:

WO2016158674A1

2016-10-06

Foreign References:

US20100216070A1	2010-08-26
JP2014125455A	2014-07-07
JP2014129340A	2014-07-10

Attorney, Agent or Firm:

NAKAMURA Yukitaka et al. (JP)

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