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Title:
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMATION METHOD
Document Type and Number:
WIPO Patent Application WO/2021/079679
Kind Code:
A1
Abstract:
Provided is a photosensitive resin composition which comprises (A) a polymer comprising repeating units represented by formula (A1) and at least one kind of repeating units selected from among repeating units represented by formula (A2) and repeating units represented by formula (A3), (B) an epoxy compound containing four or more epoxy groups on average in the molecule, (C) a photoacid generator, (D) a benzotriazole compound and/or an imidazole compound, and (E) an organic solvent.

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WO/2016/076257RESIN COMPOSITION FOR OPTICAL COMPONENTS
JPH08109149ALKYLATED AND ARALKYLATED POLYHYDROXY AROMATIC COMPOUNDS AND THEIR PRODUCTION
WO/2015/014861URBAN FURNITURE MADE FROM A COMPOSITE BIOSOURCED MATERIAL
Inventors:
HIRANO YOSHINORI (JP)
ASAI SATOSHI (JP)
GOI TAKAHIRO (JP)
Application Number:
PCT/JP2020/036015
Publication Date:
April 29, 2021
Filing Date:
September 24, 2020
Export Citation:
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Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C08G59/32; G03F7/004; G03F7/032; G03F7/075; G03F7/20; G03F7/32
Foreign References:
JP2016071355A2016-05-09
JP2019179078A2019-10-17
JP2020098296A2020-06-25
JP2008184571A2008-08-14
US3220972A1965-11-30
US3159601A1964-12-01
US3159662A1964-12-01
US3775452A1973-11-27
Other References:
See also references of EP 4050054A4
Attorney, Agent or Firm:
PATENT PROFESSIONAL CORPORATION EI-MEI PATENT OFFICE (JP)
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