Title:
PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, CURED OBJECT, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2023/210756
Kind Code:
A1
Abstract:
Provided is a photosensitive resin composition or the like that is capable of achieving both low warpage and high reflectance after a reflow process. The present invention is characterized by containing (A) a carboxyl group-containing urethane resin derived from an aliphatic diisocyanate and a diol having an aromatic ring, (B) a bifunctional (meth)acrylate, (C) a photopolymerization initiator, (D) an epoxy resin, and (E) a coloring agent that exhibits a white color.
Inventors:
ODAGIRI YUTO (JP)
NAKAJIMA KOSUKE (JP)
KOYAMA NAOHITO (JP)
MATSUMURA MASAMI (JP)
TAKASHIMA SHUHEI (JP)
NAKAJIMA KOSUKE (JP)
KOYAMA NAOHITO (JP)
MATSUMURA MASAMI (JP)
TAKASHIMA SHUHEI (JP)
Application Number:
PCT/JP2023/016685
Publication Date:
November 02, 2023
Filing Date:
April 27, 2023
Export Citation:
Assignee:
TAIYO HOLDINGS CO LTD (JP)
International Classes:
C08G18/65; G03F7/035; C08G59/46; G03F7/004; G03F7/027; H05K1/03
Foreign References:
| JP2013101185A | 2013-05-23 | |||
| JP2015199907A | 2015-11-12 | |||
| JP2013029780A | 2013-02-07 | |||
| JP5564144B1 | 2014-07-30 |
Attorney, Agent or Firm:
HONDA Ichiro (JP)
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