Title:
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, MASK MATERIAL FOR SAND BLASTING, AND METHOD FOR TREATING SURFACE OF OBJECT TO BE TREATED
Document Type and Number:
WIPO Patent Application WO/2016/152852
Kind Code:
A1
Abstract:
The present invention discloses a photosensitive resin composition which contains: component (A), a binder polymer; component (B), a photopolymerizable compound; component (C), a photopolymerization initiator; and component (D), a thermoplastic compound. Component (B) contains component (b1) that is at least two different urethane (meth)acrylates which include a urethane (meth)acrylate represented by general formula (I). (In the formula, R1 denotes a divalent organic group, and R2 denotes a group represented by general formula (II).) (In the formula, R3 denotes a hydrogen atom or a methyl group, X denotes an alkylene group, and n denotes an integer between 9 and 40.)
Inventors:
YOSHIDA TETSUYA (JP)
ITAGAKI SHUUICHI (JP)
YAMAMOTO YASUHIRO (JP)
ITAGAKI SHUUICHI (JP)
YAMAMOTO YASUHIRO (JP)
Application Number:
PCT/JP2016/058979
Publication Date:
September 29, 2016
Filing Date:
March 22, 2016
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
G03F7/027; G03F7/004; G03F7/075
Domestic Patent References:
| WO2014119562A1 | 2014-08-07 | |||
| WO2014200028A1 | 2014-12-18 | |||
| WO2014148273A1 | 2014-09-25 |
Foreign References:
| JP2015001591A | 2015-01-05 | |||
| JP2006053484A | 2006-02-23 | |||
| JP2006145606A | 2006-06-08 | |||
| JP2015143834A | 2015-08-06 | |||
| JP2010117545A | 2010-05-27 | |||
| JP2014203005A | 2014-10-27 | |||
| JP2013109323A | 2013-06-06 | |||
| JP2013080050A | 2013-05-02 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
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