Title:
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR PRODUCING SUBSTRATE WITH RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2014/148273
Kind Code:
A1
Abstract:
This photosensitive resin composition contains a binder polymer (component (A)), a photopolymerizable compound (component (B)), a photopolymerization initiator (component (C)), and a compound that has a (poly)ethylene oxide as a structural unit (component (D)). The binder polymer (component (A)) has (A1) a structural unit which is derived from at least one substance that is selected from the group consisting of styrene, styrene derivatives, benzyl (meth)acrylate and benzyl (meth)acrylate derivatives, and the content of the structural unit in the total solid content of the binder polymer is 10-60% by mass. In addition, the content of the (poly)ethylene oxide structural unit relative to the total solid content of the component (A) and the component (B) is 25% by mass or more.
Inventors:
FUJII TETSUFUMI (JP)
KUSHIDA MASATAKA (JP)
ISHI MITSURU (JP)
KUSHIDA MASATAKA (JP)
ISHI MITSURU (JP)
Application Number:
PCT/JP2014/055866
Publication Date:
September 25, 2014
Filing Date:
March 06, 2014
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
G03F7/033; G03F7/004; G03F7/027; H05K3/06; H05K3/18
Domestic Patent References:
| WO2008015983A1 | 2008-02-07 | |||
| WO2010098175A1 | 2010-09-02 |
Foreign References:
| JP2002040645A | 2002-02-06 | |||
| JP2005227528A | 2005-08-25 | |||
| JP2014048340A | 2014-03-17 |
Attorney, Agent or Firm:
Taiyo, Nakajima & Kato (JP)
Patent business corporation solar international patent firm (JP)
Patent business corporation solar international patent firm (JP)
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