Title:
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2016/080375
Kind Code:
A1
Abstract:
This photosensitive resin composition contains Component (A): a binder polymer, Component (B): a photopolymerizable compound, Component (C): a photopolymerization initiator including at least one selected from the group consisting of 2,4,5-triaryl imidazole dimer and derivatives thereof, and Component (D): a nitroxyl compound, said Component (D) including a compound having a 2,2,6,6-tetra-methylpiperidine-1-oxyl structure.
Inventors:
OOTA EMIKO (JP)
MURAMATSU YUKIKO (JP)
SAWABE KEN (JP)
OKADE SHOTA (JP)
LEE SANGCHUL (JP)
MURAMATSU YUKIKO (JP)
SAWABE KEN (JP)
OKADE SHOTA (JP)
LEE SANGCHUL (JP)
Application Number:
PCT/JP2015/082204
Publication Date:
May 26, 2016
Filing Date:
November 17, 2015
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
G03F7/004; G03F7/029; G03F7/031; G03F7/033; H05K3/06; H05K3/18
Domestic Patent References:
| WO2008105552A1 | 2008-09-04 | |||
| WO2014080834A1 | 2014-05-30 |
Foreign References:
| JP2015038607A | 2015-02-26 |
Other References:
RADIATION CURABLE PRODUCTS, 24 December 2015 (2015-12-24), pages 7 - 8
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
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