Title:
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN AND METHOD FOR PRODUCING PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2017/018053
Kind Code:
A1
Abstract:
A photosensitive resin composition which contains (A) a binder polymer, (B) a photopolymerizable compound and (C) a photopolymerization initiator, and wherein: the binder polymer (A) has a structural unit derived from a (meth)acrylic acid; and the refractive index of the binder polymer (A) is 1.504 or more.
Inventors:
NAGOSHI TOSHIMASA (JP)
KUME MASAKAZU (JP)
KUME MASAKAZU (JP)
Application Number:
PCT/JP2016/066474
Publication Date:
February 02, 2017
Filing Date:
June 02, 2016
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
G03F7/033; G03F7/004; G03F7/027; G03F7/029; H05K3/06; H05K3/18
Foreign References:
JP2007256832A | 2007-10-04 | |||
JP2007079474A | 2007-03-29 | |||
JP2009098344A | 2009-05-07 | |||
JPH04240854A | 1992-08-28 | |||
JP2014209172A | 2014-11-06 | |||
JP2008052249A | 2008-03-06 | |||
JP2010145719A | 2010-07-01 | |||
JP2012234091A | 2012-11-29 | |||
JP2012007017A | 2012-01-12 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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