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Title:
PHOTOSENSITIVE RESIN COMPOSITION, RESIN FILM, CURED FILM, SEMICONDUCTOR DEVICE PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/088469
Kind Code:
A1
Abstract:
Provided is a photosensitive resin composition that comprises a phenol resin (A) having a biphenol structure, a photoacid generator (B), and a solvent.

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Inventors:
TANAKA YUMA (JP)
Application Number:
PCT/JP2017/040412
Publication Date:
May 17, 2018
Filing Date:
November 09, 2017
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
G03F7/023; C08G8/20; C08K5/54; C08L61/04; G03F7/004; G03F7/038; G03F7/075; G03F7/20
Domestic Patent References:
WO2016143635A12016-09-15
WO2015137486A12015-09-17
WO2016158458A12016-10-06
WO2014115843A12014-07-31
Foreign References:
JP2016074874A2016-05-12
JPH08183819A1996-07-16
Attorney, Agent or Firm:
TANAI Sumio et al. (JP)
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