Title:
PHOTOSENSITIVE RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/003913
Kind Code:
A1
Abstract:
This photosensitive resin composition comprises an alkali-soluble resin, a photosensitizer, and a solvent, wherein the solvent contains a urea compound, or, an amide compound having an acyclic structure. The structure of the urea compound is preferably an acyclic structure. In addition, the urea compound is preferably tetramethylurea. Furthermore, the amide compound having an acyclic structure is preferably, for example, 3-methoxy-N,N-dimethylpropanamide. In addition, the alkali-soluble resin is preferably a polyamide resin.
Inventors:
KITAHATA TARO (JP)
KAWANAMI TAKUJI (JP)
KAWANAMI TAKUJI (JP)
Application Number:
PCT/JP2018/022532
Publication Date:
January 03, 2019
Filing Date:
June 13, 2018
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
G03F7/004; C08G69/26; G03F7/023; H05K3/28; C09B11/00; C09B11/04
Foreign References:
| JP2014157310A | 2014-08-28 | |||
| JPH11352676A | 1999-12-24 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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