Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
PHOTOSENSITIVE RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/003918
Kind Code:
A1
Abstract:
Provided is a photosensitive resin composition comprising: a silane compound (provided with a secondary amine structure, and a specific silicon-containing structure at two ends of the molecule) having a specific structure; an alkali-soluble resin; and a photosensitizer. Also, provided is a resin film obtained by curing said photosensitive resin composition. Also, provided is an electronic device provided with said resin film. The alkali-soluble resin is preferably a polyamide resin. The photosensitizer is preferably a diazoquinone compound.

Inventors:
KAWANAMI Takuji (5-8, Higashi-Shinagawa 2-chome, Shinagawa-k, Tokyo 02, 〒1400002, JP)
IKEDA Takuji (5-8, Higashi-Shinagawa 2-chome, Shinagawa-k, Tokyo 02, 〒1400002, JP)
Application Number:
JP2018/022571
Publication Date:
January 03, 2019
Filing Date:
June 13, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SUMITOMO BAKELITE CO., LTD. (5-8 Higashi-Shinagawa 2-chome, Shinagawa-ku Tokyo, 02, 〒1400002, JP)
International Classes:
G03F7/075; C08G69/26; G03F7/023; G03F7/037
Domestic Patent References:
WO2014104195A12014-07-03
Foreign References:
JPS60169847A1985-09-03
JP2015184674A2015-10-22
JP2012006324A2012-01-12
JP2015514081A2015-05-18
Attorney, Agent or Firm:
HAYAMI Shinji (KDX Gotanda Bldg. 9F, 9-2 Nishi-Gotanda 7-chome, Shinagawa-k, Tokyo 31, 〒1410031, JP)
Download PDF: