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Title:
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE FILM, RIB PATTERN FORMATION METHOD, HOLLOW STRUCTURE AND FORMATION METHOD FOR SAME, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2011/145750
Kind Code:
A1
Abstract:
Disclosed is a photosensitive resin composition having excellent resistance to moist heat, excellent hollow structure maintenance and the cured product of which has a high modulus of elasticity at high temperature. Further disclosed are an electronic component, a hollow structure and a formation method for the same, a rib pattern formation method, and a photosensitive film using the composition. The disclosed photosensitive resin composition, which can be used as a cover material or a rib material for forming a hollow structure in an electronic component having a hollow structure, contains a photopolymerisable compound (A) having at least one ethylenically unsaturated group, and a photopolymerisation initiator (B). Also disclosed is a photosensitive film which can be obtained from the photosensitive resin composition. An acrylate compound or a methacrylate compound, specifically an acrylate compound or a methacrylate compound containing an amide group, or, an acrylate compound or a methacrylate compound containing an urethane bond is used for component (A).

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Inventors:
KATOU SADAAKI (JP)
KAMEI JUNICHI (JP)
Application Number:
PCT/JP2011/062043
Publication Date:
November 24, 2011
Filing Date:
May 19, 2011
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
KATOU SADAAKI (JP)
KAMEI JUNICHI (JP)
International Classes:
G03F7/004; C08F2/44; G03F7/027; H03H3/08
Domestic Patent References:
WO2008041630A12008-04-10
Foreign References:
JP2010020108A2010-01-28
JP2010020107A2010-01-28
JP2003207889A2003-07-25
JPH05301959A1993-11-16
JP2005134893A2005-05-26
JP2010145522A2010-07-01
JP2011013602A2011-01-20
JP2009226571A2009-10-08
JP2010250020A2010-11-04
Attorney, Agent or Firm:
TAKADA, YUKIHIKO (JP)
Yukihiko Takada (JP)
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