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Title:
PHOTOSENSITIVE RESIN COMPOSITION FOR LITHOGRAPHIC PRINTING FORME AND ORIGINAL FORME FOR LITHOGRAPHIC PRINTING
Document Type and Number:
WIPO Patent Application WO/2004/035319
Kind Code:
A1
Abstract:
A photosensitive resin composition for a lithographic printing forme, characterized in that it comprises 10 to 90 wt % of a hydrophilic polymer having at least a hydrophilic group and 0.5 to 20 wt %, relative to the hydrophilic polymer, of a compound interfering with the intramolecular and/or intermolecular hydrogen bonding of the hydrophilic polymer; and an original forme for lithographic printing which preferably has a hydrophilic resin photosensitive layer prepared through the cross-linking of a photosensitive resin composition comprising 10 to 90 wt % of a hydrophilic polymer having at least a hydrophilic group and 0.5 to 20 wt %, relative to the hydrophilic polymer, of a compound interfering with the intramolecular and/or intermolecular hydrogen bonding of the hydrophilic polymer. The above photosensitive resin composition for a lithographic printing forme can be used for providing an original forme for CTP which can be handled in a lighted room, requires no development or no wiping, and exhibits excellent hydrophilic property and thus is less susceptible to scumming even when a reduced amount of dampening water is used.

Inventors:
SANADA TAKAYUKI (JP)
KOIDE AKIHIRO (JP)
SUZUKI YUKO (JP)
TAKANO KOUJI (JP)
NAITO SHINYA (JP)
Application Number:
PCT/JP2003/013008
Publication Date:
April 29, 2004
Filing Date:
October 10, 2003
Export Citation:
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Assignee:
MITSUI CHEMICALS INC (JP)
SANADA TAKAYUKI (JP)
KOIDE AKIHIRO (JP)
SUZUKI YUKO (JP)
TAKANO KOUJI (JP)
NAITO SHINYA (JP)
International Classes:
B41C1/10; B41M5/36; B41N1/14; G03F7/033; G03F7/038; (IPC1-7): B41N1/14
Domestic Patent References:
WO2001083234A12001-11-08
Foreign References:
US5914211A1999-06-22
JP2001022066A2001-01-26
Other References:
See also references of EP 1552955A4
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