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Title:
PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR CONTROL OF REFRACTIVE INDEX, AND OPTICAL WAVEGUIDE AND OPTICAL COMPONENT USING THE SAME
Document Type and Number:
WIPO Patent Application WO/2008/029816
Kind Code:
A1
Abstract:
Disclosed are: a resin composition for the formation of an optical waveguide, which shows low propagation loss and high heat stability and enables to form a waveguide pattern at high shape accuracy and at low cost; an optical waveguide; a method for forming an optical waveguide; and an optical element using the method. A photosensitive resin composition is used, which is characterized by comprising (A) a polyamic acid represented by the general formula (I) or a polyamic acid ester, (B) a compound having an epoxy group, and (C) a compound which can generate an acid upon being exposed to light.

Inventors:
CHEN NING-JUAN (JP)
ANDOH SHINJI (JP)
NAKANO KAICHIRO (JP)
MAEDA KATSUMI (JP)
Application Number:
PCT/JP2007/067241
Publication Date:
March 13, 2008
Filing Date:
August 29, 2007
Export Citation:
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Assignee:
NEC CORP (JP)
TOKYO INST TECH (JP)
CHEN NING-JUAN (JP)
ANDOH SHINJI (JP)
NAKANO KAICHIRO (JP)
MAEDA KATSUMI (JP)
International Classes:
G03F7/004; G02B6/12; G02B6/13; G03F7/038
Domestic Patent References:
WO2006008995A12006-01-26
Foreign References:
JPH06348016A1994-12-22
JP2002169286A2002-06-14
JP2001042527A2001-02-16
JP2004198992A2004-07-15
JP2004185000A2004-07-02
JP2002037885A2002-02-06
Attorney, Agent or Firm:
IKEDA, Noriyasu et al. (4-10 Nishishinbashi 1-chom, Minato-ku Tokyo 03, JP)
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