Title:
PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING RESIST PATTERN, METHOD FOR MANUFACTURING PLATED MOLDED ARTICLE, AND SEMICONDUCTOR APPARATUS
Document Type and Number:
WIPO Patent Application WO/2020/039717
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a photosensitive resin composition from which a resist pattern having good resolution and capable of coping with copper plating and nickel plating can be formed; a method for forming a resist pattern using the photosensitive resin composition; a method for manufacturing a plated molded article using the resist pattern; and a semiconductor apparatus having a plated molded article. This composition contains: a polymer (A) having a structural unit (a1) represented by formula (a1), a structural unit (a2) represented by formula (a2), and a structural unit (a3) represented by formula (a3); and a photoacid generator (B). In formula (a3), R33 represents a hydroxyaryl group.
Inventors:
SAKAKIBARA HIROKAZU (JP)
NISHIGUCHI NAOKI (JP)
TANIGUCHI TAKUHIRO (JP)
MATSUMOTO TOMOYUKI (JP)
NISHIGUCHI NAOKI (JP)
TANIGUCHI TAKUHIRO (JP)
MATSUMOTO TOMOYUKI (JP)
Application Number:
PCT/JP2019/023766
Publication Date:
February 27, 2020
Filing Date:
June 14, 2019
Export Citation:
Assignee:
JSR CORP (JP)
International Classes:
G03F7/039; C08F220/12; G03F7/20; G03F7/40; H01L21/60
Foreign References:
| JP2013137524A | 2013-07-11 | |||
| JP2004029437A | 2004-01-29 | |||
| JP2008058710A | 2008-03-13 | |||
| JP2011095662A | 2011-05-12 | |||
| JP2015041098A | 2015-03-02 |
Attorney, Agent or Firm:
KOJIMA Seiji (JP)
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