Title:
PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/115633
Kind Code:
A1
Abstract:
Provided are: a low-cost photosensitive resin composition which has high-temperature heat resistance and conductivity and is capable of forming a pattern without a fear of producing a metal impurity with respect to a semiconductor base, and which is applicable to an ion implantation process at high temperatures; and a method for manufacturing a semiconductor device, which uses this composition.
A photosensitive resin composition according to the present invention contains a photosensitive resin and particles of a conductive material and/or a semiconductor material. In addition, a method for manufacturing a semiconductor device according to the present invention comprises: a step for forming a pattern (11) of a film of this photosensitive resin composition on a semiconductor layer or base (2); a step for forming a mask (13) for ion implantation by firing the pattern of a film of this photosensitive resin composition; a step for implanting ions into the semiconductor layer or base (2) through a pattern opening (12) of the mask for ion implantation; and a step for removing the mask (13) for ion implantation.
Inventors:
SOEDA JUNSHI (JP)
IKEDA YOSHINORI (JP)
IKEDA YOSHINORI (JP)
Application Number:
PCT/JP2016/086611
Publication Date:
July 06, 2017
Filing Date:
December 08, 2016
Export Citation:
Assignee:
TEIJIN LTD (JP)
International Classes:
G03F7/004; G03F7/075; G03F7/09; G03F7/20; G03F7/40; H01L21/265; H01L21/266
Domestic Patent References:
| WO2013099785A1 | 2013-07-04 |
Foreign References:
| JP2002202584A | 2002-07-19 | |||
| JP2005148321A | 2005-06-09 | |||
| JP2015161868A | 2015-09-07 | |||
| JP2013253227A | 2013-12-19 | |||
| JP2003179031A | 2003-06-27 |
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
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