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Patent Searching and Data


Title:
PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2019/026547
Kind Code:
A1
Abstract:
A photosensitive resin composition containing: a copolymer (A) containing a structure unit (a) having a blocked isocyanate group and a structure unit (b) having an acid radical; a hydroxyl-group-containing organic solvent (B); a reactive diluent (C); and a photopolymerization initiator (D).

Inventors:
NAGAI ERI (JP)
KINOSHITA TAKEHIRO (JP)
KAWAGUCHI YASUAKI (JP)
YANAGI MASAYOSHI (JP)
KURAMOTO HIROKI (JP)
Application Number:
PCT/JP2018/025726
Publication Date:
February 07, 2019
Filing Date:
July 06, 2018
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Assignee:
SHOWA DENKO KK (JP)
International Classes:
G03F7/033; C08F2/44; C08F220/06; C08F220/10; C08F220/36; G02B5/20; G03F7/004; G03F7/20; G03F7/40
Domestic Patent References:
WO2014141731A12014-09-18
Foreign References:
JP2016084464A2016-05-19
JP2011081117A2011-04-21
JP2011070156A2011-04-07
JP2010197567A2010-09-09
Attorney, Agent or Firm:
SOGA, MICHIHARU et al. (JP)
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