Title:
PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2012/050201
Kind Code:
A1
Abstract:
The present invention provides: a photosensitive transparent resin composition having excellent thermal shock resistance in the production of products with integrated electronic parts or of solid-state imaging elements that requires a reflow soldering process; and a microplastic lens or an optical-element molded product for liquid crystal polarizing plates that uses said photosensitive transparent resin composition. The photosensitive resin composition contains: 100 parts by mass of a polyorganosiloxane (a) having a polymerizable functional group and prepared according to a method of mixing an alkoxysilane compound represented by the following general formula (1), R1
aR2
bSi(OR3)4-a-b (wherein R1, R2, R3, a, and b are as defined in the Description), with a catalyst and polymerizing the alkoxysilane compound, wherein said polyorganosiloxane (a) includes a structure represented by the following general formula (2), ≡Si-O-X-Si≡ (wherein X is as defined in the Description), and the structure of said general formula (2) contains 5 to 60% of the Si atoms contained in said polyorganosiloxane (a); and 0.01 to 30 parts by mass of a photopolymerization initiator (b).
Inventors:
KATSUMATA TORU (JP)
SAITO YAMATO (JP)
IWAKURA HIROKO (JP)
YAMAZAKI OSAMU (JP)
SAITO YAMATO (JP)
IWAKURA HIROKO (JP)
YAMAZAKI OSAMU (JP)
Application Number:
PCT/JP2011/073704
Publication Date:
April 19, 2012
Filing Date:
October 14, 2011
Export Citation:
Assignee:
ASAHI KASEI E MATERIALS CORP (JP)
KATSUMATA TORU (JP)
SAITO YAMATO (JP)
IWAKURA HIROKO (JP)
YAMAZAKI OSAMU (JP)
KATSUMATA TORU (JP)
SAITO YAMATO (JP)
IWAKURA HIROKO (JP)
YAMAZAKI OSAMU (JP)
International Classes:
C08F30/08; C08F299/08; C08G77/06; C08G77/20; C08L43/04; G03F7/075; H01L21/027
Domestic Patent References:
| WO2008123224A1 | 2008-10-16 |
Foreign References:
| JP2006508216A | 2006-03-09 | |||
| JP2010506982A | 2010-03-04 | |||
| US20040242830A1 | 2004-12-02 | |||
| JP2008007641A | 2008-01-17 | |||
| JP2008088195A | 2008-04-17 | |||
| US20050022697A1 | 2005-02-03 |
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
Aoki 篤 (JP)
Aoki 篤 (JP)
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Claims:
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