Title:
PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING HARDENED RELIEF PATTERN, SEMICONDUCTOR DEVICE AND DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2013/085004
Kind Code:
A1
Abstract:
Provided is a photosensitive resin composition which comprises: (A-1) a resin containing a structure represented by general formula (1); and (B) a photo-acid generating agent.
In general formula (1), X, R1 to R7, m1 to m4, n1, n2, Y and W are each as defined in the description.
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Inventors:
SHIBUI SATOSHI (JP)
HIRATA TATSUYA (JP)
SASAKI TAKAHIRO (JP)
YAMADA TAISUKE (JP)
HIRATA TATSUYA (JP)
SASAKI TAKAHIRO (JP)
YAMADA TAISUKE (JP)
Application Number:
PCT/JP2012/081691
Publication Date:
June 13, 2013
Filing Date:
December 06, 2012
Export Citation:
Assignee:
ASAHI KASEI E MATERIALS CORP (JP)
International Classes:
G03F7/023; C08G61/00; C08L65/00; G03F7/004
Domestic Patent References:
WO2007007827A1 | 2007-01-18 |
Foreign References:
JP2003215789A | 2003-07-30 | |||
JP2010197887A | 2010-09-09 | |||
JP2001524695A | 2001-12-04 | |||
JPS6021046A | 1985-02-02 | |||
JP2012172122A | 2012-09-10 | |||
JP2008189708A | 2008-08-21 |
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
Aoki 篤 (JP)
Aoki 篤 (JP)
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Claims: