Title:
PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED FILM, CURED FILM, ORGANIC EL DISPLAY DEVICE, AND LIQUID CRYSTAL DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/002861
Kind Code:
A1
Abstract:
Provided is a photosensitive resin composition. This photosensitive resin composition contains (A) a polymer component which contains a polymer that satisfies (1) and/or (2) described below, (B) a photoacid generator, (C) an alicyclic epoxy compound having a molecular weight of less than 1,000, and (D) a solvent.
(1) a polymer which has (a1) a constituent unit having a residue wherein an acid group is protected with an acid-decomposable group and (a2) a constituent unit having an epoxy group
(2) (a1) a polymer which has a constituent unit having a residue wherein an acid group is protected with an acid-decomposable group, and (a2) a polymer which has a constituent unit having an epoxy group
Inventors:
KASHIWAGI DAISUKE (JP)
YAMADA SATORU (JP)
YAMADA SATORU (JP)
Application Number:
PCT/JP2013/066914
Publication Date:
January 03, 2014
Filing Date:
June 20, 2013
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/039; C08F220/26; C08F220/32; C08L63/00; G03F7/004; H01L51/50; H05B33/22
Foreign References:
JP2009098616A | 2009-05-07 | |||
JP2012108403A | 2012-06-07 | |||
JP2012234148A | 2012-11-29 | |||
JP2011013502A | 2011-01-20 | |||
JP2003081956A | 2003-03-19 | |||
JPH0418460A | 1992-01-22 | |||
JP2008007782A | 2008-01-17 |
Attorney, Agent or Firm:
SIKs & Co. (JP)
Patent business corporation patent firm Sykes (JP)
Patent business corporation patent firm Sykes (JP)
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