Title:
PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN
Document Type and Number:
WIPO Patent Application WO/2018/037997
Kind Code:
A1
Abstract:
Provided is a negative photosensitive resin composition with which it is possible to produce a resin layer having a preferable imidation ratio and a high chemical resistance even under low-temperature curing condition of not higher than 200°C, and which contains a photopolymerization initiator (B) in a proportion of 0.1-20 parts by mass with respect to 100 parts by mass of a polyimide precursor (A), wherein: the polyimide precursor (A) is a polyamic acid ester or a polyamic acid salt that has a specific structure; and the polyimide precursor (A) has a weight average molecular weight (Mw) of not less than 3,000 but less than 16,000 in terms of polystyrene equivalent as measured by gel permeation chromatography (GPC).
Inventors:
YORISUE TOMOHIRO (JP)
NAKAMURA MITSUTAKA (JP)
INOUE TAIHEI (JP)
HIRATA TATSUYA (JP)
SASAKI TAKAHIRO (JP)
NAKAMURA MITSUTAKA (JP)
INOUE TAIHEI (JP)
HIRATA TATSUYA (JP)
SASAKI TAKAHIRO (JP)
Application Number:
PCT/JP2017/029554
Publication Date:
March 01, 2018
Filing Date:
August 17, 2017
Export Citation:
Assignee:
ASAHI CHEMICAL IND (JP)
International Classes:
G03F7/037; C08G73/10
Domestic Patent References:
| WO2014097633A1 | 2014-06-26 |
Foreign References:
| JPS6315847A | 1988-01-22 | |||
| JP2004271801A | 2004-09-30 | |||
| JPH11133604A | 1999-05-21 | |||
| JP2003286345A | 2003-10-10 | |||
| JP2000080068A | 2000-03-21 | |||
| JP2012194520A | 2012-10-11 |
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
Download PDF: