Title:
PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, CURED FILM, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE PROTECTIVE FILM AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2019/124477
Kind Code:
A1
Abstract:
A photosensitive resin composition which contains (A) a polyimide precursor which has a polymerizable unsaturated bond, (B) a polymerizable compound which has an aliphatic cyclic skeleton, (C) thermal base generator, and (D) a photopolymerization initiator.
Inventors:
YONEDA SATOSHI (JP)
ENOMOTO TETSUYA (JP)
YOSHIZAWA ATSUTARO (JP)
ENOMOTO TETSUYA (JP)
YOSHIZAWA ATSUTARO (JP)
Application Number:
PCT/JP2018/046905
Publication Date:
June 27, 2019
Filing Date:
December 20, 2018
Export Citation:
Assignee:
HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD (JP)
International Classes:
G03F7/004; C08G73/12; G03F7/027; G03F7/20
Domestic Patent References:
| WO2017038664A1 | 2017-03-09 | |||
| WO2017002858A1 | 2017-01-05 | |||
| WO2015199219A1 | 2015-12-30 |
Foreign References:
| US20160187775A1 | 2016-06-30 |
Attorney, Agent or Firm:
HEIWA INTERNATIONAL PATENT OFFICE (JP)
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