PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED PRODUCT, CURED PRODUCT, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT

Title:

PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED PRODUCT, CURED PRODUCT, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT

Document Type and Number:

WIPO Patent Application WO/2020/071204

Kind Code:

A1

Abstract:

This photosensitive resin composition contains (A) a polyimide precursor having a polymerizable unsaturated bond, (B) a polymerizable monomer having an aliphatic cyclic skeleton, (C) a photopolymerization initiator, (D) a compound having an anthracene structure, and (E) a solvent.

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Inventors:

MATSUKAWA DAISAKU (JP)
SAITO NOBUYUKI (JP)
YOTSUYANAGI HIROKO (JP)
YAMAZAKI NORIYUKI (JP)

Application Number:

PCT/JP2019/037574

Publication Date:

April 09, 2020

Filing Date:

September 25, 2019

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Assignee:

HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD (JP)

International Classes:

G03F7/031; C08G73/10; G03F7/004; G03F7/027; G03F7/20

Domestic Patent References:

WO2015072533A1	2015-05-21
WO2015111607A1	2015-07-30

Foreign References:

JP2018084626A	2018-05-31
JP2014214186A	2014-11-17
JP2007256525A	2007-10-04
JP2011033772A	2011-02-17

Attorney, Agent or Firm:

HEIWA INTERNATIONAL PATENT OFFICE (JP)

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