Title:
PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING RESIST PATTERN FILM, AND METHOD FOR PRODUCING PLATED SHAPED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2020/218062
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a photosensitive resin composition for forming a resist pattern film having reduced traces of standing waves and having a rectangular cross section. The photosensitive resin composition of the present invention comprises (A) a polymer having an acid-dissociable group, (B) a photo-acid generator, (C) a carbamic acid ester having a hydroxyl group and (D) a solvent, wherein the solvent (D) comprises at least one solvent (D1) selected from propylene glycol monomethyl ether acetate and others and at least one solvent (D2) selected from dipropylene glycol dimethyl ether and others.
Inventors:
SANO YUKA (JP)
MATSUMOTO TOMOYUKI (JP)
SAKAKIBARA HIROKAZU (JP)
MATSUMOTO TOMOYUKI (JP)
SAKAKIBARA HIROKAZU (JP)
Application Number:
PCT/JP2020/016292
Publication Date:
October 29, 2020
Filing Date:
April 13, 2020
Export Citation:
Assignee:
JSR CORP (JP)
International Classes:
G03F7/004; G03F7/039; G03F7/20
Domestic Patent References:
| WO2011162303A1 | 2011-12-29 |
Foreign References:
| JP2010243873A | 2010-10-28 | |||
| JP2016075726A | 2016-05-12 | |||
| JP2017223977A | 2017-12-21 |
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
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