Title:
PHOTOSENSITIVE RESIN COMPOSITION AND ORGANIC EL ELEMENT PARTITION WALL
Document Type and Number:
WIPO Patent Application WO/2020/240925
Kind Code:
A1
Abstract:
Provided is a highly-sensitive photosensitive resin composition that contains a coloring agent, and can inhibit a coating from coming off in a development step. The photosensitive resin composition according to an embodiment of the present invention contains a binder resin (A), a compound (B) having a triazine ring and represented by formula (1), a radiation-sensitive compound (C), and a coloring agent (D) selected from the group consisting of black dyes and black pigments. (In formula (1), R1, R2, and R3 each independently represent a hydroxy group, an alkyl group having 1-5 carbon atoms, an alkenyl group having 2-6 carbon atoms, an alkenyl ether group having 2-6 carbon atoms, an optionally substituted amino group, a halogenated alkyl group, a sulfide group, a mercapto group, a phenyl group, a phenyl ether group, a halogeno group, a naphthyl group, a pyridyl group, a biphenyl group, a morpholino group, a fluorene group, or a carbazole group.)
Inventors:
ARAI YOSHIKAZU (JP)
Application Number:
PCT/JP2020/003539
Publication Date:
December 03, 2020
Filing Date:
January 30, 2020
Export Citation:
Assignee:
SHOWA DENKO KK (JP)
International Classes:
G03F7/004; G03F7/023; H01L51/50; H05B33/12; H05B33/22
Domestic Patent References:
| WO2017069172A1 | 2017-04-27 |
Foreign References:
| JP2016031788A | 2016-03-07 | |||
| JP2002116536A | 2002-04-19 | |||
| JP2008058756A | 2008-03-13 |
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
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