Title:
PHOTOSENSITIVE RESIN COMPOSITION AND PATTERN STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2019/194286
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a photosensitive resin composition with which it is possible, when made into a pattern structure, to form a gap having a high aspect ratio and a satisfactory shape; and a pattern structure. This photosensitive resin structure contains an alkali-soluble binder polymer, a photopolymerizable compound having an ethylenically unsaturated bond, and a photopolymerization initiator, wherein the acid value of the binder polymer is 100 to 200 mgKOH/g inclusive, the photopolymerization initiator is an acyl phosphine oxide compound or a titanocene compound, the photopolymerization initiator content is no greater than 1.0 mass% relative to the total solid content of the photosensitive resin composition, and the average I/O value of the photopolymerizable compound is in the range of 1.1 to 1.5.
Inventors:
OBA TATSUYA (JP)
KAMO MAKOTO (JP)
KAMO MAKOTO (JP)
Application Number:
PCT/JP2019/015009
Publication Date:
October 10, 2019
Filing Date:
April 04, 2019
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/029; C08F220/18; G02F1/1339; G03F7/033; G02F1/1333
Domestic Patent References:
| WO2012141153A1 | 2012-10-18 |
Foreign References:
| JP2017187654A | 2017-10-12 | |||
| JP2016095500A | 2016-05-26 | |||
| JP2007249148A | 2007-09-27 | |||
| JP2016157451A | 2016-09-01 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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