Title:
PHOTOSENSITIVE RESIN COMPOSITION, PHOTORESIST FILM USING SAME, RESIST PATTERN FORMING METHOD, AND CONDUCTOR PATTERN FORMING METHOD
Document Type and Number:
WIPO Patent Application WO/2012/118031
Kind Code:
A1
Abstract:
The present invention relates to a photosensitive resin composition comprising a binder polymer, a photopolymerizable monomer containing an amine group, a photopolymerization initiator, and a benzotriazole derivative containing a carboxyl group. The present invention also relates to a photoresist film containing a photosensitive resin composition layer comprising the photosensitive resin composition and a support layer. The photosensitive resin composition and photoresist film provide excellent resolution and adhesion, an extremely small fringe on the cured resist after development, and excellent release properties.
Inventors:
TOYOTA HIROKI
Application Number:
PCT/JP2012/054824
Publication Date:
September 07, 2012
Filing Date:
February 27, 2012
Export Citation:
Assignee:
NICHIGO MORTON CO LTD (JP)
TOYOTA HIROKI
TOYOTA HIROKI
International Classes:
G03F7/027; G03F7/004; G03F7/085; H05K3/06; H05K3/18
Foreign References:
| JPH07253667A | 1995-10-03 | |||
| JP2006519404A | 2006-08-24 | |||
| JP2006259700A | 2006-09-28 | |||
| JPH07168357A | 1995-07-04 |
Attorney, Agent or Firm:
Shin-Ei Patent Firm, P. C. (JP)
Patent business corporation Shin-Ei Patent Firm (JP)
Patent business corporation Shin-Ei Patent Firm (JP)
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Claims: