Title:
PHOTOSENSITIVE RESIN COMPOSITION, PLATING METHOD, AND METHOD FOR PRODUCING METAL PATTERN
Document Type and Number:
WIPO Patent Application WO/2020/027024
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing the following: a photosensitive resin composition which exhibits high resolution, with which peeling of a resist is easy even in a narrow pitch resist pattern, and with which ultrafine lines and dots are stably held on a base material in a pattern forming step or plating step; and a plating method that uses this photosensitive resin composition. The problem is solved by: a photosensitive resin composition which contains (A) an alkali-soluble resin, (B) a photopolymerization initiator and (C) an acrylate monomer, and in which the content of a methacrylate monomer (D) is 0-5 mass% relative to the acrylate monomer (C), an ethylene oxide-modified pentaerythritol tetraacrylate (C1) (a compound which is represented by general formula (i) and in which l+m+n+o=24-48) is contained as the acrylate monomer (C), and the content of component (C1) relative to the total amount of component (C) is 30-70 mass%; and a plating method and method for producing a metal pattern in which the photosensitive resin composition is used.
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Inventors:
IRISAWA MUNETOSHI (JP)
NAKAMURA YUKO (JP)
ITO NOBORU (JP)
KAJIYA KUNIHITO (JP)
NAKAMURA YUKO (JP)
ITO NOBORU (JP)
KAJIYA KUNIHITO (JP)
Application Number:
PCT/JP2019/029588
Publication Date:
February 06, 2020
Filing Date:
July 29, 2019
Export Citation:
Assignee:
MITSUBISHI PAPER MILLS LTD (JP)
International Classes:
G03F7/027; C08F2/44; C08F265/06; G03F7/20; G03F7/40; H05K3/18
Domestic Patent References:
| WO2009128369A1 | 2009-10-22 | |||
| WO2016035897A1 | 2016-03-10 |
Foreign References:
| JP2017167395A | 2017-09-21 | |||
| JP2012220837A | 2012-11-12 | |||
| JP2013092693A | 2013-05-16 |
Attorney, Agent or Firm:
TAKAHASHI INTERNATIONAL PATENT OFFICE (JP)
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