PHOTOSENSITIVE RESIN COMPOSITION AND PROCESS FOR THE FORMATION OF HYDROGEL

Title:

PHOTOSENSITIVE RESIN COMPOSITION AND PROCESS FOR THE FORMATION OF HYDROGEL

Document Type and Number:

WIPO Patent Application WO/2004/044024

Kind Code:

A1

Abstract:

A photosensitive resin composition comprising (A) a water-soluble photosensitive poly(meth)acrylic acid resin which is produced by addition reaction of part of the carboxyl groups of a (meth)acrylic acid polymer with a compound represented by the general formula (1) and has an acid number of solids of 150mgKOH/g or above, (B) a photopolymerization initiator, and (C) water: (1) wherein R¹ is H or Me; and R² is linear or branched alkylene having 2 to 10 carbon atoms.

More Like This:

JPH08504849	INDUSTRIAL APPLICABILITY: Leather and fur softening / oiling and greasing methods
WO/1996/028515	BLOOD-ABSORBENT RESIN COMPOSITION AND ABSORBENT ARTICLES
WO/1993/013161	METHOD FOR PRODUCTIONAL THERMOSTABLE CHEMICAL RESISTANT PLASTICS

Inventors:

UTSUNOMIYA SHIN (JP)
YAMADA SEIGO (JP)
TAKANO MASAHIRO (JP)
MIYAZAKI MITSUHARU (JP)

Application Number:

PCT/JP2003/014466

Publication Date:

May 27, 2004

Filing Date:

November 13, 2003

Export Citation:

Click for automatic bibliography generation Help

Assignee:

TOYO GOSEI CO LTD (JP)
UTSUNOMIYA SHIN (JP)
YAMADA SEIGO (JP)
TAKANO MASAHIRO (JP)
MIYAZAKI MITSUHARU (JP)

International Classes:

C08F8/14; G03F7/027; C08F265/02; C08F290/12; C08F299/00; C08L51/00; G03F7/038; (IPC1-7): C08F299/04

Foreign References:

JPH11327139A	1999-11-26
JP2002214354A	2002-07-31
JPH103167A	1998-01-06

Other References: