PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE CURED FILM USING SAME, AND POLYIMIDE CURED FILM

WIPO Patent Application WO/2023/228568

A1

According to the present disclosure, there are provided: a photosensitive resin composition which has low dielectric properties, low cure shrinkage, good storage stability, and reduced phase separation during coating, and with which a cured relief pattern having high resolution and high copper adhesion can be formed; a method for producing a polyimide cured film using said composition; and a polyimide cured film. The photosensitive resin composition of the present disclosure includes 100 parts by mass of a copolymer resin containing polyimide and a polyimide precursor, 0.5–30 parts by mass of a photopolymerization initiator, and 100–1000 parts by mass of a solvent. The copolymer resin has a polyimide block portion and a polyimide precursor block portion with a specific structure, and the copolymer resin composed of the polyimide and the polyimide precursor satisfies the formula 0.10