Title:
PHOTOSENSITIVE RESIN COMPOSITION FOR PROTECTIVE FILM OF PRINTED WIRING BOARD FOR SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2010/026927
Kind Code:
A1
Abstract:
Disclosed is a photosensitive resin composition for a protective film of a printed wiring board for a semiconductor package. The photosensitive resin composition contains (A) an acid-modified vinyl group-containing epoxy resin, (B) a phenol compound, (C) a compound having at least one ethylenically unsaturated group in each molecule, (D) a photopolymerization initiator and (E) inorganic fine particles.
Inventors:
KURAFUCHI KAZUHIKO (JP)
YOSHINO TOSHIZUMI (JP)
KATAGI HIDEYUKI (JP)
OOKAWA MASAYA (JP)
FUSE YOSHIAKI (JP)
YOSHINO TOSHIZUMI (JP)
KATAGI HIDEYUKI (JP)
OOKAWA MASAYA (JP)
FUSE YOSHIAKI (JP)
Application Number:
PCT/JP2009/065069
Publication Date:
March 11, 2010
Filing Date:
August 28, 2009
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
KURAFUCHI KAZUHIKO (JP)
YOSHINO TOSHIZUMI (JP)
KATAGI HIDEYUKI (JP)
OOKAWA MASAYA (JP)
FUSE YOSHIAKI (JP)
KURAFUCHI KAZUHIKO (JP)
YOSHINO TOSHIZUMI (JP)
KATAGI HIDEYUKI (JP)
OOKAWA MASAYA (JP)
FUSE YOSHIAKI (JP)
International Classes:
G03F7/004; G03F7/027; H05K3/28
Foreign References:
| JP2004138835A | 2004-05-13 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
Download PDF:
Previous Patent: ROLLING BEARING
Next Patent: OIL-AND-FAT COMPOSITION AND PLASTIC OIL-AND-FAT COMPOSITION
Next Patent: OIL-AND-FAT COMPOSITION AND PLASTIC OIL-AND-FAT COMPOSITION