Title:
PHOTOSENSITIVE RESIN COMPOSITION, RESIST LAMINATE, AND ARTICLES OBTAINED BY CURING SAME (4)
Document Type and Number:
WIPO Patent Application WO/2014/080972
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide the following: a photosensitive epoxy resin composition that, via photolithography, can form a high-resolution, low-stress image that has vertical side walls and resists moisture and heat, and/or a resist laminate using said photosensitive epoxy resin composition; and an article or articles obtained by curing said photosensitive epoxy resin composition and/or resist laminate. The present invention is a photosensitive resin composition containing the following: an epoxy resin (A), a polyol compound (B) having a specific structure, a cationic-polymerization photoinitiator (C), a silane compound (D) containing an epoxy group, and a reactive epoxy monomer (E) having a specific structure. The epoxy resin (A) contains the phenol derivative represented by formula (1), an epoxy resin (a) obtained via a reaction with epihalohydrin, and an epoxy resin (b) that can be represented by formula (2).
Inventors:
IMAIZUMI NAOKO (JP)
INAGAKI SHINYA (JP)
HONDA NAO (JP)
INAGAKI SHINYA (JP)
HONDA NAO (JP)
Application Number:
PCT/JP2013/081360
Publication Date:
May 30, 2014
Filing Date:
November 21, 2013
Export Citation:
Assignee:
NIPPON KAYAKU KK (JP)
International Classes:
G03F7/038; G03F7/004; C08G59/62
Domestic Patent References:
| WO2009151050A1 | 2009-12-17 |
Foreign References:
| JPH10168165A | 1998-06-23 | |||
| JP2006169326A | 2006-06-29 | |||
| JPH09255765A | 1997-09-30 | |||
| JP2010276694A | 2010-12-09 | |||
| JP2008020838A | 2008-01-31 | |||
| JP2008020839A | 2008-01-31 | |||
| JP2009265449A | 2009-11-12 | |||
| JPH0317117A | 1991-01-25 | |||
| JP2000044776A | 2000-02-15 | |||
| JP2010271401A | 2010-12-02 |
Attorney, Agent or Firm:
ASAMURA PATENT OFFICE, p. c. (JP)
Patent business corporation Asamura patent firm (JP)
Patent business corporation Asamura patent firm (JP)
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