Title:
PHOTOSENSITIVE RESIN COMPOSITION FOR RESIST MATERIAL, AND PHOTOSENSITIVE RESIN LAMINATE
Document Type and Number:
WIPO Patent Application WO/2011/037182
Kind Code:
A1
Abstract:
Disclosed is a photosensitive resin composition for a resist material, which contains (A) 30-70% by mass of an alkali-soluble polymer, (B) 20-60% by mass of a compound that has an ethylenically unsaturated double bond, and (C) 0.1-20% by mass of a photopolymerization initiator. The photosensitive resin composition contains, as (B) the compound that has an ethylenically unsaturated double bond, (B-1) a compound that has at least a hydroxyl group, a phenyl group and two or more ethylenically unsaturated double bonds in each molecule, and (B-2) a compound that has an ethylene oxide group and a (meth)acryloyl group in each molecule.
Inventors:
TSUTSUI YAMATO (JP)
Application Number:
PCT/JP2010/066546
Publication Date:
March 31, 2011
Filing Date:
September 24, 2010
Export Citation:
Assignee:
ASAHI KASEI E MATERIALS CORP (JP)
TSUTSUI YAMATO (JP)
TSUTSUI YAMATO (JP)
International Classes:
G03F7/027; G03F7/004; H01L21/027
Foreign References:
| JP2000047381A | 2000-02-18 | |||
| JPS61201237A | 1986-09-05 | |||
| JP2000044922A | 2000-02-15 | |||
| JPH08248634A | 1996-09-27 | |||
| JP2008256790A | 2008-10-23 | |||
| JP2004264560A | 2004-09-24 | |||
| JP2008546872A | 2008-12-25 | |||
| JP2010160300A | 2010-07-22 | |||
| JP2010160419A | 2010-07-22 |
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
Aoki 篤 (JP)
Aoki 篤 (JP)
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