Title:
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN SHEET, CURED FILM, METHOD FOR PRODUCING CURED FILM, ORGANIC EL DISPLAY DEVICE AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2020/184326
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a photosensitive resin composition which exhibits good imidization rate even in cases where the photosensitive resin composition is fired at a temperature of 200°C or less, while having high pattern processability, and a cured film of which exhibits high long-term reliability if used in an organic EL display device. In order to solve the above-described problem, a photosensitive resin composition according to the present invention contains (a) a polyimide precursor, (b) a phenolic compound having an electron-withdrawing group and (c) a photosensitive compound; and the polyimide precursor (a) has a residue which is derived from a diamine that has an ionization potential of less than 7.1 eV.
Inventors:
KOMORI YUSUKE (JP)
SUMI TAKASHI (JP)
MIYOSHI KAZUTO (JP)
SUMI TAKASHI (JP)
MIYOSHI KAZUTO (JP)
Application Number:
PCT/JP2020/009104
Publication Date:
September 17, 2020
Filing Date:
March 04, 2020
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
G03F7/004; G03F7/023; G03F7/20; G03F7/40; G09F9/30; H01L27/32; H01L51/50; H05B33/22
Foreign References:
| JP2011197362A | 2011-10-06 | |||
| JP2015004000A | 2015-01-08 |
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