PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE SHEET, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

WIPO Patent Application WO/2016/158150

A1

A photosensitive resin composition which contains a compound represented by general formula (1). (In general formula (1), R1-R4 may be the same or different, and each represents a hydrogen atom or an organic group having 1-4 carbon atoms; and X represents a tetravalent organic group having two or more structural units represented by general formula (2) in the main chain.) (In general formula (2), R5 represents a hydrogen atom or an alkyl group having 1-20 carbon atoms, and a plurality of R5 moieties in one same molecule may be the same as or different from each other.) Provided is a photosensitive resin composition which enables the achievement of a cured film having low stress after being heated and fired, and which has excellent long-term stability, high sensitivity and high resolution.

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ONISHI HIROYUKI (JP)
MASUDA YUKI (JP)

PCT/JP2016/056053

October 06, 2016

February 29, 2016

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TORAY INDUSTRIES (JP)

G03F7/023; C08G65/331; C08G65/333; G03F7/004

WO2015125514A1

2015-08-27

JP2013254081A	2013-12-19
JP2010211095A	2010-09-24
JP2007163756A	2007-06-28
JP2005234434A	2005-09-02
JPH03107160A	1991-05-07
JP2012208360A	2012-10-25

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