Title:
PHOTOSENSITIVE RESIN COMPOSITION AND USE THEREOF
Document Type and Number:
WIPO Patent Application WO/2011/043320
Kind Code:
A1
Abstract:
Disclosed is a photosensitive resin composition containing components (A), (B) and (C), wherein the proportional ratio of the component (B) is 5-50 parts by mass and the proportional ratio of the component (C) is 1-50 parts by mass, respectively relative to 100 parts by mass of the component (A). The component (A) is a copolymer that has a constituent unit (a1) that is derived from a specific itaconic acid diester monomer, a constituent unit (a2) that is derived from a specific aromatic vinyl monomer and a constituent unit (a3) that is derived from a specific α,β-unsaturated carboxylic acid monomer. The component (B) is an esterified product having a quinonediazide group, and the component (C) is a crosslinkable compound having an epoxy group.
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Inventors:
NITO YOSHINORI (JP)
TAGUCHI HIROYUKI (JP)
KATO YUKIHIRO (JP)
TAGUCHI HIROYUKI (JP)
KATO YUKIHIRO (JP)
Application Number:
PCT/JP2010/067425
Publication Date:
April 14, 2011
Filing Date:
October 05, 2010
Export Citation:
Assignee:
NOF CORP (JP)
NITO YOSHINORI (JP)
TAGUCHI HIROYUKI (JP)
KATO YUKIHIRO (JP)
NITO YOSHINORI (JP)
TAGUCHI HIROYUKI (JP)
KATO YUKIHIRO (JP)
International Classes:
G03F7/023; C08F212/08; C08F220/06; C08F222/14; G03F7/004; H01L21/027
Foreign References:
| JP2003345016A | 2003-12-03 | |||
| JPH10148931A | 1998-06-02 | |||
| JP2008156393A | 2008-07-10 |
Attorney, Agent or Firm:
ONDA, Hironori et al. (JP)
Hironori Onda (JP)
Hironori Onda (JP)
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