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Patent Searching and Data


Title:
PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2007/086323
Kind Code:
A1
Abstract:
A photosensitive resin composition which is useful especially as a buffer coating material for LSI chips; and a resin film obtained from the photosensitive resin composition. The photosensitive resin composition comprises: 100 parts by weight of a polycondensate obtained by condensation-polymerizing compounds represented by specific chemical formulae in a specific proportion; 0.01-5 parts by weight of a photopolymerization initiator; and 1-30 parts by weight of a specific organosilane. The resin film is obtained by applying the photosensitive resin composition to a silicon wafer surface and subjecting the coating to exposure to light, development, and curing.

Inventors:
KOBAYASHI TAKAAKI (JP)
KIMURA MASASHI (JP)
Application Number:
PCT/JP2007/050793
Publication Date:
August 02, 2007
Filing Date:
January 19, 2007
Export Citation:
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Assignee:
ASAHI KASEI EMD CORP (JP)
KOBAYASHI TAKAAKI (JP)
KIMURA MASASHI (JP)
International Classes:
G03F7/075; C08F290/14; C08F299/08; C08G59/18; C08G77/04
Foreign References:
JPS63251407A1988-10-18
JP2005004052A2005-01-06
JP2000105457A2000-04-11
JPH08311139A1996-11-26
JPS63117024A1988-05-21
JPH10298254A1998-11-10
JPH1010741A1998-01-16
JPH0436353A1992-02-06
JPS55120619A1980-09-17
JPH04198270A1992-07-17
JPH0632903A1994-02-08
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