Title:
PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2010/098312
Kind Code:
A1
Abstract:
Disclosed is a photosensitive resin composition which has excellent transparency, heat resistance, thermal discoloration resistance, adhesion to a substrate and electrical characteristics, while exhibiting good developability and storage stability.
Specifically disclosed is a photosensitive resin composition which contains the following components (A), (B) and (C).
(A) a copolymer which contains (a1) hydroxyphenyl (meth)acrylate and (a2) an unsaturated epoxy compound as copolymerization components
(B) a novolac resin which contains one or more phenols selected from among dimethylphenol, trimethylphenol, methylpropylphenol, dipropylphenol, butylphenol, methylbutylphenol, dibutylphenol, and 4,4'-dihydroxy-2,2'-diphenylpropane
(C) a quinonediazide group-containing compound
Inventors:
ENDO ATSUO (JP)
ICHIKAWA TAKAO (JP)
TSUJIMURA YUMI (JP)
ICHIKAWA TAKAO (JP)
TSUJIMURA YUMI (JP)
Application Number:
PCT/JP2010/052747
Publication Date:
September 02, 2010
Filing Date:
February 23, 2010
Export Citation:
Assignee:
SHOWA HIGHPOLYMER (JP)
ENDO ATSUO (JP)
ICHIKAWA TAKAO (JP)
TSUJIMURA YUMI (JP)
ENDO ATSUO (JP)
ICHIKAWA TAKAO (JP)
TSUJIMURA YUMI (JP)
International Classes:
G03F7/023; C08G59/20; C08G59/62; H01L21/027
Foreign References:
| JP2006308612A | 2006-11-09 | |||
| JP2008165127A | 2008-07-17 | |||
| JP2007033518A | 2007-02-08 | |||
| JPH11255855A | 1999-09-21 | |||
| JP2005221515A | 2005-08-18 | |||
| JPH11167204A | 1999-06-22 | |||
| JP2004271767A | 2004-09-30 |
Attorney, Agent or Firm:
SOGA, Michiharu et al. (JP)
Michiharu Soga (JP)
Michiharu Soga (JP)
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