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Title:
PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2011/108705
Kind Code:
A1
Abstract:
Disclosed is a photosensitive resin composition—that can form a minute pattern by means of photolithography, can form a insulating film without heat treatment above 200°C, and has no problems of carrier being trapped and charge mobility decreasing when used as a gate insulating film of an organic thin-film transistor—containing a photo-radical generating agent and a polysiloxane compound having units represented by the belowmentioned general formulae (1-4). (In formula 1, R1 represents a hydrogen atom or a methyl group, and R2 represents an alkylene group having a carbon number of 1-5 that may have a substituent alkyl group. In formula 2, R3 represents a hydrogen atom or an alkyl group having a carbon number of 1-4. In formula 3, R4 represents an alkyl group having a carbon number of 1-6 or a cycloalkyl group having a carbon number of 5-6. In formula 4, R5 represents a hydrogen atom or an alkyl group having a carbon number of 1-4.)

Inventors:
HARA, Kenji (2-35 Higashiogu 7-chome, Arakawa-k, Tokyo 54, 〒1168554, JP)
Application Number:
JP2011/055074
Publication Date:
September 09, 2011
Filing Date:
March 04, 2011
Export Citation:
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Assignee:
ADEKA CORPORATION (2-35, Higashiogu 7-chome Arakawa-k, Tokyo 54, 〒1168554, JP)
株式会社ADEKA (〒54 東京都荒川区東尾久7丁目2番35号 Tokyo, 〒1168554, JP)
International Classes:
G03F7/075; C08F299/08; C08G77/14; C08G77/20; C08L83/04; H01L21/027
Foreign References:
JPS53134085A
JP2010039056A
Attorney, Agent or Firm:
HATORI, Osamu (AKASAKA HKN BLDG, 6F. 8-6, Akasaka 1-chome, Minato-k, Tokyo 52, 〒1070052, JP)
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Claims: