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Title:
PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2013/146360
Kind Code:
A1
Abstract:
[Problem] To provide a photosensitive resin composition. [Solution] A photosensitive resin composition containing component (A), component (B) and a solvent. Component (A): A copolymer having a structural unit represented by formula (1) and a structural unit represented by formula (2). Component (B): A photosensitizer. (In the formulae, R0 denotes a hydroxyl group or a carboxyl group, R1 denotes a hydrogen atom or a methyl group, R2 denotes a single bond or an alkylene group having 1-5 carbon atoms, and R3 denotes a thermally crosslinkable monovalent organic group. However, the R1 groups may be different from each other in the case of a plurality of structural units represented by formula (2).)

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Inventors:
ADACHI ISAO (JP)
SAKAGUCHI TAKAHIRO (JP)
SODA HIROYUKI (JP)
Application Number:
PCT/JP2013/057447
Publication Date:
October 03, 2013
Filing Date:
March 15, 2013
Export Citation:
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Assignee:
NISSAN CHEMICAL IND LTD (JP)
International Classes:
G03F7/023; C08F220/10; C08F222/40; G02B3/00; G03F7/004; H01L21/027
Domestic Patent References:
WO2012073742A12012-06-07
Foreign References:
JP2005049720A2005-02-24
JP2004212752A2004-07-29
JP2010008561A2010-01-14
JP2001354822A2001-12-25
JP4462576B22010-05-12
Other References:
See also references of EP 2833203A4
Attorney, Agent or Firm:
HANABUSA, Tsuneo et al. (JP)
Sepal Tsuneo (JP)
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