Title:
PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2015/025925
Kind Code:
A1
Abstract:
Provided is a photosensitive resin composition which enables the formation of a small diameter via without the occurrence of an undercut at the via bottom. A photosensitive resin composition which contains an epoxy resin (component (A)), a (meth)acrylate-modified phenolic resin (component (B)), a photopolymerization initiator (component (C)) and an inorganic filler (component (D)). The epoxy resin (component (A)) contains an epoxy resin having a number average molecular weight of 1,000 or less, and if the non-volatile content in the photosensitive resin composition is taken as 100% by mass, the content of the inorganic filler (component (D)) is 35% by mass or more.
Inventors:
YODA MASANORI (JP)
HATADA NORIKO (JP)
NAKAMURA SHIGEO (JP)
HATADA NORIKO (JP)
NAKAMURA SHIGEO (JP)
Application Number:
PCT/JP2014/071898
Publication Date:
February 26, 2015
Filing Date:
August 21, 2014
Export Citation:
Assignee:
AJINOMOTO KK (JP)
International Classes:
G03F7/004; G03F7/031; G03F7/032; G03F7/038; H05K1/03; H05K3/46
Domestic Patent References:
| WO2013162015A1 | 2013-10-31 |
Foreign References:
| JP2012073601A | 2012-04-12 | |||
| JP2005024659A | 2005-01-27 | |||
| JP2010249886A | 2010-11-04 | |||
| JP2011075923A | 2011-04-14 | |||
| JP2005037755A | 2005-02-10 | |||
| JP2011043806A | 2011-03-03 | |||
| JP2010222398A | 2010-10-07 | |||
| JP2011140534A | 2011-07-21 | |||
| JP2001011301A | 2001-01-16 | |||
| JP2014081612A | 2014-05-08 | |||
| JP5576545B1 | 2014-08-20 | |||
| JP5458215B1 | 2014-04-02 |
Attorney, Agent or Firm:
SAKAI, Hiroaki et al. (JP)
Hiroaki Sakai (JP)
Hiroaki Sakai (JP)
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