Title:
PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2016/152656
Kind Code:
A1
Abstract:
Provided is a photosensitive resin composition that, despite having high sensitivity, can improve cohesion between a pattern curing film and metal wiring subsequent to a reflow process in a pattern curing film of a semiconductor device. This photosensitive resin composition is characterized by containing: at least one alkali-soluble resin selected from (a-1) resins principally containing a structure represented by general formula (1), (a-2) polyimides, and copolymers of these; and (c) a compound principally containing a structure represented by general formula (2).
Inventors:
IKEDA YOSHIFUMI (JP)
Application Number:
PCT/JP2016/058175
Publication Date:
September 29, 2016
Filing Date:
March 15, 2016
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
G03F7/023; C08G8/10; C08G73/14; C08G73/22; G03F7/004
Foreign References:
| JP2014186186A | 2014-10-02 | |||
| JP2002258485A | 2002-09-11 | |||
| JP2014066764A | 2014-04-17 | |||
| JP2001312066A | 2001-11-09 | |||
| JP2005290194A | 2005-10-20 |
Attorney, Agent or Firm:
Seiryu Patent Professional Corporation et al. (JP)
Clear stream international patent business corporation (JP)
Clear stream international patent business corporation (JP)
Download PDF: