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Title:
PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2016/163540
Kind Code:
A1
Abstract:
A photosensitive resin composition comprises an alkali-soluble polymer, a compound having an ethylenically unsaturated bond and a photopolymerization initiator, and has such a property that, when a photosensitive resin layer made from the photosensitive resin composition is formed on the surface of a substrate, then the photosensitive resin layer is exposed to light and is developed to form a resist pattern, and then the resist pattern is treated with a chemical solution for chemical solution resistance evaluation use, the smallest line width of the cured resist lines is 17 μm or less.

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Inventors:
KUNIMATSU SHINICHI (JP)
MATSUDA TAKAYUKI (JP)
YAMADA YURI (JP)
TSUTSUI YAMATO (JP)
FUJIWARA AKIRA (JP)
Application Number:
PCT/JP2016/061610
Publication Date:
October 13, 2016
Filing Date:
April 08, 2016
Export Citation:
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Assignee:
ASAHI CHEMICAL IND (JP)
International Classes:
G03F7/027; C08F2/50; G03F7/004; G03F7/029; G03F7/031; G03F7/033; H05K3/06; H05K3/18
Domestic Patent References:
WO2009078380A12009-06-25
WO2006011548A12006-02-02
WO2015178462A12015-11-26
WO2008075575A12008-06-26
Foreign References:
JP2008094803A2008-04-24
JP2007133349A2007-05-31
JP2000347400A2000-12-15
JP2006145844A2006-06-08
JP2011215366A2011-10-27
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
Aoki 篤 (JP)
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