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Patent Searching and Data


Title:
PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2018/194169
Kind Code:
A1
Abstract:
[Problem] To provide a photosensitive resin composition which is suitable as a pixel spacing wall material or a patterned insulating film-forming material used for a liquid crystal display device, an organic EL display device, and the like, can retain a good image even after being cured, has high water repellency and high oil repellency even when not subjected to a treatment such as oxygen plasma treatment, has little residue, and is capable of forming an image of a cured film having high lyophilicity and high lipophilicity on a substrate. [Solution] The present invention provides a thermosettable photosensitive resin composition containing the following components (A), (B), (C), and (D), where component (A) is a polymer having (A1) a liquid-repellent group and (A2) a group selected from among an N-alkoxymethylamide group, a blocked isocyanate group, and a trialkoxysilyl group, component (B) is an alkali-soluble resin, component (C) is a solvent, and component (D) is a compound having a quinone diazide group.

Inventors:
HOSHINO YUKI (JP)
YUKAWA SHOJIRO (JP)
OMURA HIROYUKI (JP)
HATANAKA TADASHI (JP)
Application Number:
PCT/JP2018/016354
Publication Date:
October 25, 2018
Filing Date:
April 20, 2018
Export Citation:
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Assignee:
NISSAN CHEMICAL CORP (JP)
International Classes:
G03F7/023; C08F220/10; G03F7/004; G03F7/075
Domestic Patent References:
WO2007132890A12007-11-22
WO2008090827A12008-07-31
WO2017126610A12017-07-27
Foreign References:
JP2017016116A2017-01-19
JP2002090991A2002-03-27
JP2012220860A2012-11-12
Attorney, Agent or Firm:
HANABUSA PATENT & TRADEMARK OFFICE (JP)
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