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Title:
PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2019/044874
Kind Code:
A1
Abstract:
Provided are: a photosensitive resin composition which enables the achievement of a cured body that is further decreased in dielectric constant and dielectric loss tangent; a method for producing a cured relief pattern with use of this photosensitive resin composition; and a semiconductor device which is provided with this cured relief pattern. A negative photosensitive resin composition which contains 100 parts by mass of (A) a polyimide precursor that has a specific unit structure and 0.1-20 parts by mass of (B) a radical photopolymerization initiator.

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Inventors:
OHASHI TAKUYA (JP)
NISHIMURA NAOYA (JP)
ENDO MASAHISA (JP)
KISHIOKA TAKAHIRO (JP)
Application Number:
PCT/JP2018/031879
Publication Date:
March 07, 2019
Filing Date:
August 29, 2018
Export Citation:
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Assignee:
NISSAN CHEMICAL CORP (JP)
International Classes:
G03F7/027; C08G73/10; G03F7/20; H01L21/312
Foreign References:
JP2014201696A2014-10-27
JP2000273172A2000-10-03
JP2016027357A2016-02-18
JP2011053678A2011-03-17
JP2015163955A2015-09-10
US20160377765A12016-12-29
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
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