Title:
PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2019/156000
Kind Code:
A1
Abstract:
[Problem] To provide a photosensitive resin composition which is suitable as a pixel barrier material and a material for forming a patterned insulating film that is used for liquid crystal display elements, organic EL display elements and the like, and which is able to maintain a good image even after curing and is capable of forming an image of a cured film having high lypophilicity on a substrate without requiring oxygen plasma processing or the like, while having high oil repellency even after UV ozone processing.
[Solution] A thermally curable photosensitive resin composition which contains component (A), component (B), solvent (C) and component (D) described below.
(A): a polysiloxane having the following groups (A1) and (A2)
(A1): an organic group having a fluorine atom
(A2): an organic group having a thermally crosslinkable group
(B): an alkali-soluble resin
(C): a solvent
(D): a sensitizing agent
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Inventors:
OMURA HIROYUKI (JP)
YUKAWA SHOJIRO (JP)
YUKAWA SHOJIRO (JP)
Application Number:
PCT/JP2019/003674
Publication Date:
August 15, 2019
Filing Date:
February 01, 2019
Export Citation:
Assignee:
NISSAN CHEMICAL CORP (JP)
International Classes:
G03F7/075; G02F1/1333; G03F7/004; G03F7/023; G09F9/30; H01L27/32; H01L51/50; H05B33/12; H05B33/22; C08G77/24
Domestic Patent References:
WO2013161829A1 | 2013-10-31 | |||
WO2015163379A1 | 2015-10-29 |
Foreign References:
JP2012118354A | 2012-06-21 | |||
JP2008107529A | 2008-05-08 | |||
JPH09208704A | 1997-08-12 |
Attorney, Agent or Firm:
HANABUSA PATENT & TRADEMARK OFFICE (JP)
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