PHOTOSENSITIVE RESIN FILM, RESIST PATTERN FORMING METHOD, AND WIRING PATTERN FORMING METHOD

Title:

PHOTOSENSITIVE RESIN FILM, RESIST PATTERN FORMING METHOD, AND WIRING PATTERN FORMING METHOD

Document Type and Number:

WIPO Patent Application WO/2021/075005

Kind Code:

A1

Abstract:

The present invention pertains to a photosensitive resin film that contains a binder polymer, a photo-polymerizable compound, a photoinitiator, and a polymerization inhibitor, and that has a thickness of 35-300 μm.

Inventors:

ARAI TATSUHIKO (JP)
HIRAYAMA FUUKA (JP)
ONO KEISHI (JP)
NARITA MAO (JP)
FUKAYA TAKAHIRO (JP)

Application Number:

PCT/JP2019/040754

Publication Date:

April 22, 2021

Filing Date:

October 16, 2019

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Assignee:

SHOWA DENKO MATERIALS CO LTD (JP)

International Classes:

G03F7/40; G03F7/004; G03F7/027; G03F7/42

Domestic Patent References:

WO2018173840A1	2018-09-27
WO2013172302A1	2013-11-21

Foreign References:

JP2005309273A	2005-11-04
JP2006251386A	2006-09-21
JP2009020191A	2009-01-29
JP2002372781A	2002-12-26
JP2013200328A	2013-10-03
JP2012215676A	2012-11-08

Attorney, Agent or Firm:

HASEGAWA Yoshiki et al. (JP)

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