Title:
PHOTOSENSITIVE RESIN LAMINATE AND METHOD FOR PRODUCING RESIST PATTERN
Document Type and Number:
WIPO Patent Application WO/2019/088268
Kind Code:
A1
Abstract:
A photosensitive resin laminate provided with a support film and a photosensitive resin composition layer that includes a photosensitive resin composition, wherein: the photosensitive resin composition includes (A) an alkali-soluble polymer; the support film can be separated from the photosensitive resin composition layer; and the water content included in the photosensitive resin composition layer is 0.1% by mass or more, where the total mass of the photosensitive resin composition layer is 100% by mass.
Inventors:
INOUE KOSUKE (JP)
KUNIMATSU SHINICHI (JP)
KOTANI YUZO (JP)
KUNIMATSU SHINICHI (JP)
KOTANI YUZO (JP)
Application Number:
PCT/JP2018/040908
Publication Date:
May 09, 2019
Filing Date:
November 02, 2018
Export Citation:
Assignee:
ASAHI CHEMICAL IND (JP)
International Classes:
G03F7/004; G03F7/029; G03F7/09; G03F7/20; G03F7/40; G03F7/42; H05K3/06; H05K3/18
Foreign References:
| JP2005202066A | 2005-07-28 | |||
| JP2012215676A | 2012-11-08 | |||
| JPH0299958A | 1990-04-11 |
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
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